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PACK EXPO 2009  Visit the OMAC Packaging Workgroup Booth at PACK EXPO 2009 Where: Booth C-949
“Packaging Standards Deliver More Cost Effective Solutions” Visit the OMAC Packaging Workgroup (OPW) booth at the Las Vegas Convention Center as we showcase how "Packaging Standards Deliver More Cost Effective Solutions" when leveraging the ISA88 Connect-and-Pack™ standards at PACK EXPO 2009. The booth showcase will include demonstrations from several different companies highlighting the cost benefits achieved when utilizing the Connect-and-Pack™ packaging standards. The Connect-and-Pack™ standards of PackML and PackTags were approved in August 2008, as part of the ISA88 standards. Connect-and-Pack™ standards make packaging operations more effective by simplifying customization and integration, which enables world class packaging operations. When implemented, packaging companies and their partners gain a competitive advantage as they leverage an integrated supply chain to optimize operations. Presentation Schedule
Thank You to Our In-booth Demonstration SponsorsOMAC Packaging Workgroup Onsite Meeting Where: N115, Las Vegas Convention Center Meeting Agenda:
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